PROJECT TITLE :

Stereo Vision Based Automated Solder Ball Height and Substrate Coplanarity Inspection

ABSTRACT:

Solder ball height and substrate coplanarity inspection is crucial to the detection of potential connectivity problems in semi-conductor units. Current ball height and substrate coplanarity inspection tools such as laser profiling, fringe projection, and confocal microscopy are expensive, require sophisticated setup and are slow, that makes them difficult to use in a very real-time manufacturing setting. Therefore, a reliable, in-line ball height and substrate coplanarity measurement method is needed for inspecting units undergoing assembly.