PROJECT TITLE :

Area-Array of 3-Arc-Fan Compliant Interconnects as Effective Drop-Impact Isolator for Microsystems

ABSTRACT:

Compliant off-chip interconnects as the primary-level and second-level compliant interconnect structures can accommodate the differential displacement between the die and therefore the substrate or between the substrate and therefore the board because of their high in-plane and out-of-plane compliance. This paper presents experimental and simulation results of drop testing of silicon substrates with micro-scale copper compliant interconnects assembled on organic boards. The micro-scale copper compliant interconnects during this paper are three-arc-fan compliant interconnects with arcuate beam width equal to 10, fifteen, and 20 μm, respectively. The samples with 3-arc-fan compliant interconnects were subjected to drop tests at varying drop heights starting from twenty to 50 cm in steps of ten cm. The experimental and simulation results were compared against the corresponding results obtained from the samples assembled with the solder ball interconnects. Through drop-take a look at experiments and simulations, it is shown that the three-arc-fan compliant interconnects when scaled down in size and fabricated through copper electroplating method will be able to isolate the strain transferred from an organic board to a silicon substrate, and that the impact isolation increases with the increased compliance of the interconnects.