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  3. Device and Materials Reliability
  4. FinFETs With a Deep Buried Channel to Reduce the Readout Noise in CMOS Image Sensors
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Category: Device and Materials Reliability
By MTech Projects
MTech Projects
15.May
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FinFETs With a Deep Buried Channel to Reduce the Readout Noise in CMOS Image Sensors

PROJECT TITLE :

FinFETs With a Deep Buried Channel to Reduce the Readout Noise in CMOS Image Sensors

ABSTRACT:

FinFETs with a deep buried channel (DBC) are proposed for the reduction of readout noise in complementary metal-oxide–semiconductor image sensors (CISs). Simulation results show that the influence of defects at the Si/SiO2 interface on the drain current is reduced for the DBC style as the drain current variation in DBC FinFETs is fifty% smaller than those in surface- and buried-channel metal-oxide–semiconductor field-effect transistor. The potential barriers at the fin sidewalls serve to confine electrons removed from the defects at the Si/SiO2 interface, ensuing in decreased readout noise within the CIS.

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